Mastering AI Chip Complexity
Explore challenges and solutions in AI chip development
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Synopsys 3DIC Compiler platform enables efficient multi-die/advanced package co-design and optimization for 2.5D and 3D multi-die designs. In a single environment, the platform enables analysis-driven feasibility exploration, partitioning, prototyping, and floorplanning for comprehensive full-stack designs. In addition, the platform accelerates advanced packaging design with automated high-speed die-to-die routing, multiphysics analysis, and signoff verification. 3DIC Compiler integrates with Ansys® RedHawk-SC™, RedHawk-SC Electrothermal, and HFSS to enable automation and optimization for multiphysics analysis including power and signal integrity, thermal, and mechanical stress. In addition, the platform uses AI capabilities to maximize system performance and quality of results at a rapid pace. The 3DIC Compiler platform, adopted by leading HPC/AI customers, is certified by major foundries for advanced process and packaging technologies.
Differentiated Features
- Automated high-speed die-to-die routing for UCIe and HBM improves efficiency, signal integrity, and scalability.
- Support for a wide range of advanced packaging technologies, including interposer-based designs, LSI bridges, fanout, and system-on-wafer, provides flexibility.
- Support for major foundries including TSMC, Samsung, Intel Foundry, GlobalFoundries, Rapidus, and UMC.
- Integration with silicon-proven Synopsys IP streamlines implementation and IP integration.
- Combination of 3DIC Compiler, Synopsys TestMAX and Silicon Lifecycle Management solutions enables test, repair, & analytics functions.
What's New
