Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Unintentional Antennas and Their Role in EMC Problems
This interactive, virtual event will explain the main ways that cables and boards can act like antennas even though they're not designed to radiate. We'll discuss the two main radiating mech
.. read more
Turning Workforce Funding Opportunities into Employer Success
Building on the themes from my recent Community Magazine article, “Unlocking Workforce Potential: Beyond Federal Dollars,” this webinar will unpack how employers across the U.S. can access a
.. read more
Identifying Circuit Board Issues with Thermal Imaging
This webinar explains how to use visual inspection alongside a plug-in thermal camera to detect circuit board faults. By spotting heat anomalies, engineers can quickly locate overheating com
.. read more
Turning Supply Chain Security into Business Value
Join us for a practical, business-first approach to supply chain security. This webinar explores how involving non-IT stakeholders early in the process leads to smarter investments, fewer mi
.. read more
Modern Wire Bonding in Package Assembly
Wire bonding remains the dominant chip-interconnection method—and it's not going anywhere soon. This webinar offers a practical overview of modern wire bonding processes, metrology challenge
.. read more
Supply Chain Integrity: Protecting Your Business from Counterfeit Electronics
Join SAE G19A subcommittee expert Anthony Bryant for an essential one-hour webinar focused on supply chain integrity and counterfeit electronics prevention. This session is specifically desi
.. read more
Electronic Essentials: What You Think You Know - and More
This webinar, titled "Electronic Essentials: What You Think You Know - and More", is a foundational session aimed at reinforcing the core knowledge that every technician, inspector, assemble
.. read more
Evaluating Ruggedizing Polymers: Insights from Condensing Environmental Conditions
Evaluating the protective efficacy of ruggedizing polymers using condensing environments is an innovative approach that can help simulate real-world conditions. Protective polymers are incre
.. read more
Achieving Lower Voids with a Novel Preform Flux Technology
Many of today’s advanced electronic devices require the use of solderable preforms in applications, including solder thermal interface materials (TIMs), power module attach, and any other ap
.. read more
A Novel Fully Recyclable and Biodegradable PCB Material with a Drastically Reduced Carbon Footprint for Single Use and Short Lifetime...
The paper presents the development of an innovative recyclable and biodegradable PCB substrate material created to meet the stringent environmental demands of future electronic products. The
.. read more
High Density Substrates for Chiplet Technologies
The increasing demands on electronic systems have led to the current trend of using chiplets instead of individual chips. In detail, this means that individual silicon components or function
.. read more
Implementing IPC-1782 External Traceability for Trusted Material Provenance across the Supply Chain
The IPC-1782 traceability standard is a key part of the IPC Factory of the Future ecosystem, providing a framework for ensuring trusted product and material provenance. The purpose of this s
.. read more
Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing – Part II
For many years, metals have been used as thermal interface materials (TIMs), and until recently, the most common type of metal TIM were solder TIMs. Due to their high reliability and thermal
.. read more
iNEMI Reliability and Loss Properties of Copper Foils for 5G Applications
The advancement of high-frequency applications, especially for 5G technology, demands PCBs endure thermal shock during soldering while preserving signal integrity. Traditional copper foil su
.. read more
Process Traceability in Hand Soldering, Rework and Repair – The Missing Link.
Since its inception, the electronics manufacturing industry has developed methods to improve the efficiency of its many processes. One of the key methods developed and now a fundamental proc
.. read more
Robotic Process for Fast and Reliable BGA Re-balling
Enabling re-use of expensive BGA components with fast & high quality of BGA re-balling process can be a cost-effective solution.It fits many electronic segments such as military, aer
.. read more
The Human Edge in Digital Manufacturing - Beyond Automation the Role of People in Industry 4.0
Industry 4.0 defined a vision for the factory where automation dynamically adjusts and adapts to its operational demands and to the products it is building. What has been overlooked is the c
.. read more
Direct Digital Manufacturing of Glass Additively Manufactured Electronics
Direct Digital Manufacturing (DDM) of additive electronics has gained considerable momentum in recent years due to the 3D design creativity that its additive materials provide. However, the
.. read more
Optimizing SMT Printing: The Impact of Contact Time and Fluid Dynamics on Yield Enhancement
In the quest for perfection within SMT printing, numerous factors such as print speed, blade pressure, and nano-coatings have been meticulously studied. Yet, the solvent delivery system—a cr
.. read more
Early Defect Detection with a Scalable Broad-Spectrum Test Using Radiofrequency Reflectometry
This work explores radio frequency (RF) reflectometry as an early-stage defect detection technology for electronics. In-circuit testing (ICT) is limited to fully assembled boards, while auto
.. read more
Tooling Population Effects on Imaging Registration Accuracy for UHDI Substrates
A study of methods for improving direct imaging registration for Ultra High Density Interconnect [UHDI], flex and other challenging constructs using new and existing registration technologie
.. read more
Printed Circuit Board Challenges for Achieving Signal Integrity at 224Gb/s and Beyond
The datacenter continues to demand increasingly higher component data rates to satisfy growing application requirements. Efforts are underway, as illustrated by the IEEE 802.3dj objectives[1
.. read more
Design Considerations for Sustainable Printed Circuit Boards
In addition to manufacturability, performance, reliability and cost, environmental impact increasingly becomes a design driver for printed circuit boards and assemblies. A prerequisite is th
.. read more
Alternative Methods in Measuring BGAs for Thermal Warpage
Warpage determination for ball grid array (BGA) packages require measurement of the surface containing solder balls. Balls can be sheared, and the surface painted. Surface damage can alter t
.. read more
Enhancements in Reliability Achieved through the Integration of Polymer Reinforcement and Solder Alloy Materials
The increasing use of larger Ball Grid Arrays (BGAs), ceramic packages, and Wafer-Level Chip Scale Packages (WLCSP) to enhance device functionality requires improved reliability in challengi
.. read more
Benefits and Advantages of a Variable Angle Screen Printer Head/Squeegee
A variable angle print head offers significant advantages in screen printing, allowing the user to adjust the squeegee angle of attack with precision to achieve optimal results. This feature
.. read more
Novel Supercooled Solder Materials for Lower-Than-Liquidus Reflow
Metastable solder pastes offer a compelling advancement in low-temperature soldering, providing the capability to form robust metal interconnects at temperatures significantly lower than tho
.. read more
Electrolytic Nickel Ultra-Thin Gold Finish for PCBs
An electrolytic plate ultra-thin gold (UTG) over 2.5 to 5 microns(μ) pure nickel is an economical and environmentally friendly printed circuit board (PCB) finish, tested over 100,000M2. UTG
.. read more
Understanding PCB Failure Mechanisms under High Voltage and Condensing Conditions
Miniaturization has exacerbated the issue of electronics failure due to humidity by reducing the spacing between components, increasing the possibility of droplet bridging to create pathways
.. read more
Improving THT-AOI Image Classification through Federated Learning: A Study on Model Performance and Training Stability under Various Data Distributions
Automated optical inspection (AOI) systems are commonly applied for in-line quality control of through hole technology (THT) solder joints. However, these systems usually rely on conventiona
.. read more
Unintentional Antennas and Their Role in EMC Problems
This interactive, virtual event will explain the main ways that cables and boards can act like antennas even though they're not designed to radiate. We'll discuss the two main radiating mech
.. read more
Turning Workforce Funding Opportunities into Employer Success
Building on the themes from my recent Community Magazine article, “Unlocking Workforce Potential: Beyond Federal Dollars,” this webinar will unpack how employers across the U.S. can access a
.. read more
Identifying Circuit Board Issues with Thermal Imaging
This webinar explains how to use visual inspection alongside a plug-in thermal camera to detect circuit board faults. By spotting heat anomalies, engineers can quickly locate overheating com
.. read more
Turning Supply Chain Security into Business Value
Join us for a practical, business-first approach to supply chain security. This webinar explores how involving non-IT stakeholders early in the process leads to smarter investments, fewer mi
.. read more
Modern Wire Bonding in Package Assembly
Wire bonding remains the dominant chip-interconnection method—and it's not going anywhere soon. This webinar offers a practical overview of modern wire bonding processes, metrology challenge
.. read more
Supply Chain Integrity: Protecting Your Business from Counterfeit Electronics
Join SAE G19A subcommittee expert Anthony Bryant for an essential one-hour webinar focused on supply chain integrity and counterfeit electronics prevention. This session is specifically desi
.. read more
Electronic Essentials: What You Think You Know - and More
This webinar, titled "Electronic Essentials: What You Think You Know - and More", is a foundational session aimed at reinforcing the core knowledge that every technician, inspector, assemble
.. read more
Evaluating Ruggedizing Polymers: Insights from Condensing Environmental Conditions
Evaluating the protective efficacy of ruggedizing polymers using condensing environments is an innovative approach that can help simulate real-world conditions. Protective polymers are incre
.. read more
Achieving Lower Voids with a Novel Preform Flux Technology
Many of today’s advanced electronic devices require the use of solderable preforms in applications, including solder thermal interface materials (TIMs), power module attach, and any other ap
.. read more
A Novel Fully Recyclable and Biodegradable PCB Material with a Drastically Reduced Carbon Footprint for Single Use and Short Lifetime...
The paper presents the development of an innovative recyclable and biodegradable PCB substrate material created to meet the stringent environmental demands of future electronic products. The
.. read more
High Density Substrates for Chiplet Technologies
The increasing demands on electronic systems have led to the current trend of using chiplets instead of individual chips. In detail, this means that individual silicon components or function
.. read more
Implementing IPC-1782 External Traceability for Trusted Material Provenance across the Supply Chain
The IPC-1782 traceability standard is a key part of the IPC Factory of the Future ecosystem, providing a framework for ensuring trusted product and material provenance. The purpose of this s
.. read more
Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing – Part II
For many years, metals have been used as thermal interface materials (TIMs), and until recently, the most common type of metal TIM were solder TIMs. Due to their high reliability and thermal
.. read more
iNEMI Reliability and Loss Properties of Copper Foils for 5G Applications
The advancement of high-frequency applications, especially for 5G technology, demands PCBs endure thermal shock during soldering while preserving signal integrity. Traditional copper foil su
.. read more
Process Traceability in Hand Soldering, Rework and Repair – The Missing Link.
Since its inception, the electronics manufacturing industry has developed methods to improve the efficiency of its many processes. One of the key methods developed and now a fundamental proc
.. read more
Robotic Process for Fast and Reliable BGA Re-balling
Enabling re-use of expensive BGA components with fast & high quality of BGA re-balling process can be a cost-effective solution.It fits many electronic segments such as military, aer
.. read more
The Human Edge in Digital Manufacturing - Beyond Automation the Role of People in Industry 4.0
Industry 4.0 defined a vision for the factory where automation dynamically adjusts and adapts to its operational demands and to the products it is building. What has been overlooked is the c
.. read more
Direct Digital Manufacturing of Glass Additively Manufactured Electronics
Direct Digital Manufacturing (DDM) of additive electronics has gained considerable momentum in recent years due to the 3D design creativity that its additive materials provide. However, the
.. read more
Optimizing SMT Printing: The Impact of Contact Time and Fluid Dynamics on Yield Enhancement
In the quest for perfection within SMT printing, numerous factors such as print speed, blade pressure, and nano-coatings have been meticulously studied. Yet, the solvent delivery system—a cr
.. read more
Early Defect Detection with a Scalable Broad-Spectrum Test Using Radiofrequency Reflectometry
This work explores radio frequency (RF) reflectometry as an early-stage defect detection technology for electronics. In-circuit testing (ICT) is limited to fully assembled boards, while auto
.. read more
Tooling Population Effects on Imaging Registration Accuracy for UHDI Substrates
A study of methods for improving direct imaging registration for Ultra High Density Interconnect [UHDI], flex and other challenging constructs using new and existing registration technologie
.. read more
Printed Circuit Board Challenges for Achieving Signal Integrity at 224Gb/s and Beyond
The datacenter continues to demand increasingly higher component data rates to satisfy growing application requirements. Efforts are underway, as illustrated by the IEEE 802.3dj objectives[1
.. read more
Design Considerations for Sustainable Printed Circuit Boards
In addition to manufacturability, performance, reliability and cost, environmental impact increasingly becomes a design driver for printed circuit boards and assemblies. A prerequisite is th
.. read more
Alternative Methods in Measuring BGAs for Thermal Warpage
Warpage determination for ball grid array (BGA) packages require measurement of the surface containing solder balls. Balls can be sheared, and the surface painted. Surface damage can alter t
.. read more
Enhancements in Reliability Achieved through the Integration of Polymer Reinforcement and Solder Alloy Materials
The increasing use of larger Ball Grid Arrays (BGAs), ceramic packages, and Wafer-Level Chip Scale Packages (WLCSP) to enhance device functionality requires improved reliability in challengi
.. read more
Benefits and Advantages of a Variable Angle Screen Printer Head/Squeegee
A variable angle print head offers significant advantages in screen printing, allowing the user to adjust the squeegee angle of attack with precision to achieve optimal results. This feature
.. read more
Novel Supercooled Solder Materials for Lower-Than-Liquidus Reflow
Metastable solder pastes offer a compelling advancement in low-temperature soldering, providing the capability to form robust metal interconnects at temperatures significantly lower than tho
.. read more
Electrolytic Nickel Ultra-Thin Gold Finish for PCBs
An electrolytic plate ultra-thin gold (UTG) over 2.5 to 5 microns(μ) pure nickel is an economical and environmentally friendly printed circuit board (PCB) finish, tested over 100,000M2. UTG
.. read more
Understanding PCB Failure Mechanisms under High Voltage and Condensing Conditions
Miniaturization has exacerbated the issue of electronics failure due to humidity by reducing the spacing between components, increasing the possibility of droplet bridging to create pathways
.. read more
Improving THT-AOI Image Classification through Federated Learning: A Study on Model Performance and Training Stability under Various Data Distributions
Automated optical inspection (AOI) systems are commonly applied for in-line quality control of through hole technology (THT) solder joints. However, these systems usually rely on conventiona
.. read more