Design Lines
SoC Designline

The SoC Designline features the latest news and trends in EDA tools and core-IP used in ASIC and system on chip designs for the global electronics industry.

ADI to Acquire IVR Tech to Join Data Center’s Power Gold Rush
SoC Designline
ADI to Acquire IVR Tech to Join Data Center’s Power Gold Rush
Empower Semiconductor’s integrated voltage regulators (IVRs) can be placed directly inside an AI processor package.
By   May 19, 2026
ASML, Tata Electronics Partner for India’s First 300-mm Semiconductor Fab
ASML, Tata Electronics Partner for India’s First 300-mm Semiconductor Fab
By   05.18.2026
Bluetooth ULL SCI Redefines Wireless Interaction – Telink Unleashes Sub-Millisecond HID Performance
Bluetooth ULL SCI Redefines Wireless Interaction – Telink Unleashes Sub-Millisecond HID Performance
By Telink 05.17.2026
Apple-Intel Foundry Deal Could Reshape U.S. Chip Manufacturing
By   05.12.2026
AI Delivers Faster, Actionable DRC Closure for Complex SoC Designs 
By James Paris 05.12.2026
Wooptix Targets AI Packaging Bottleneck with Astronomy Tech
By   05.11.2026

Partner Content

New Power, Memory, Interconnect, and Thermal Architectures for AI Infrastructure at Scale
New Power, Memory, Interconnect, and Thermal Architectures for AI Infrastructure at Scale
By Raj Khattoi, Vice President and General Manager, Consumer, Computing and Communication, Infineon Technologies  05.18.2026
Bluetooth ULL SCI Redefines Wireless Interaction – Telink Unleashes Sub-Millisecond HID Performance
Bluetooth ULL SCI Redefines Wireless Interaction – Telink Unleashes Sub-Millisecond HID Performance
By Telink 05.17.2026