2nd Annual International Conference
IEEE AMES 2026 - Additively Manufactured Electronic Systems
πŸ“ Leuven, Belgium
πŸ“… September 14-15, 2026

Organized by KU Leuven Additive Manufacturing Institute
Sponsored by IEEE Council on RFID and IEEE Microwave Theory and Technology Society

Welcome to IEEE AMES 2026

The 2026 IEEE International Conference on Additively Manufactured Electronic Systems addresses research, development, and applications of additive and advanced manufacturing for electronic systems.

Topics include printed and hybrid electronics, flexible and stretchable circuits, 3D printed RF/microwave components, antennas and sensors, electronic packaging, and integration for IoT, automotive, aerospace, and wearable systems. The conference aims to foster collaboration among academia, industry, and standards bodies.

2

Days

50+

Expected Papers

10+

Countries

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Additive Manufacturing

Advanced manufacturing techniques for next-generation electronics

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Printed Electronics

Flexible and stretchable circuits, 3D printed components

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RF & Microwave

3D printed antennas, sensors, and RF components

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IoT & Wearables

Integration for automotive, aerospace, and wearable systems

Important Dates

Mark your calendar with these key deadlines.
All times are 11:59 PM AoE (Anywhere on Earth).

May 20, 2026

FINAL Paper Submission Deadline

Submit your full paper for review

June 12, 2026

Notification of Acceptance

Authors will be notified of decisions

July 3, 2026

Final Paper Submission

Camera-ready papers due

September 14-15, 2026

Conference Dates

Join us in Leuven, Belgium

Keynote Speakers

Meet the invited keynote speakers for IEEE AMES 2026.

Prof. Will Witthow

Prof. Will Witthow

Loughborough University, United Kingdom

3D Printed Antennas, Metamaterials, and Metasurfaces for Microwave Applications

Prof. Wim Deferme

Prof. Wim Deferme

Hasselt University, Belgium

Printed and Flexible Electronics, Smart Sensors, and Functional Materials Engineering

Call for Papers

We invite researchers and practitioners to submit original contributions in all areas of additively manufactured electronic systems.

Full Papers

Submit a full paper in IEEE format (3–4 pages). During submission, authors may indicate their preferred presentation format: oral, poster, or no preference.

One-page abstracts

Submit a 1-page abstract describing ongoing work, recent results, or early-stage ideas. These submissions are non-archival and will not be included in IEEE Xplore.

πŸ…

Special Sessions

Focused sessions on emerging topics in additive manufacturing. Please contact 2026ames@kuleuven.be for more information.

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Call for Workshops

Interested in organizing a workshop? Please contact 2026ames@kuleuven.be for more information.

Topics of Interest

AM-enabled conformal, 3D, and flexible antennas Embedded and printed RF circuits and passive components Dielectric and engineered EM structures fabricated by AM mmWave, THz, and advanced RF systems enabled by AM AM-enabled embedded electronics and structural integration Smart textiles and wearable electronic platforms Electronics packaging & Interconnects Design for additive manufacturing (DfAM) Conductive and dielectric materials for AM electronics Real-time quality control and defect detection Multi-material integration and functional composites Optimized processing/design

For the complete list of topics, please refer to the Call for Papers.

Organization Committee

Meet the distinguished researchers and professionals organizing IEEE AMES 2026.

Luca Catarinucci

Luca Catarinucci

General Co-Chair

LinkedIn

University of Salento

Niels Benson

Niels Benson

General Co-Chair

LinkedIn

UniversitΓ€t Duisburg-Essen

Eleonora Ferraris

Eleonora Ferraris

Executive Co-Chair

LinkedIn

KU Leuven

Arnout Dejans

Arnout Dejans

Executive Co-Chair

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KU Leuven

Ultan McCarthy

Ultan McCarthy

Conference Treasurer

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South East Technological University

Massimo Merenda

Massimo Merenda

TPC Co-Chair

LinkedIn

University of Reggio Calabria

Canek Fuentes-Hernandez

Canek Fuentes-Hernandez

TPC Co-Chair

LinkedIn

Northeastern University, USA

Francesco P. Chietera

Francesco P. Chietera

Special Session Co-Chair

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Polytechnic of Bari

Carola Corcione

Carola Corcione

Special Session Co-Chair

LinkedIn

University of Salento

Simone Genovesi

Simone Genovesi

Special Session Co-Chair

LinkedIn

University of Pisa

Almudena Rivadeneyra

Almudena Rivadeneyra

Special Session Co-Chair

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University of Granada

Carlo Massaroni

Carlo Massaroni

Special Session Co-Chair

LinkedIn

Campus Bio-Medico University of Rome

Martina Bevacqua

Martina Bevacqua

YP - WiM/WiE Co-Chair

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University of Reggio Calabria

Valentina Palazzi

Valentina Palazzi

YP - WiM/WiE Co-Chair

LinkedIn

University of Perugia

Sara Amendola

Sara Amendola

Industry/Patrons Chair

LinkedIn

Radio6sense

Andrea Casula

Andrea Casula

Publication Chair

LinkedIn

University of Cagliari

Alessia Lazzaro

Alessia Lazzaro

Webmaster Chair

LinkedIn

University of Reggio Calabria

Conference Venue

Join us at the historic Irish College Leuven in the heart of Belgium.

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Irish College Leuven

Leuven Institute for Ireland in Europe

The Irish College Leuven is a historic venue with modern conference facilities, located in the beautiful university city of Leuven, Belgium. The venue offers an inspiring atmosphere for academic discourse and networking.

πŸ“

Address

Janseniusstraat 1, 3000 Leuven, Belgium

πŸš†

By Train

10 min walk from Leuven Central Station

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By Air

Brussels Airport (BRU) - 25 km from Leuven

Discover Leuven

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Historic City

Home to KU Leuven, one of Europe's oldest and most prestigious universities. Explore what Leuven has to offer, and how you can extend your stay: https://www.visitleuven.be/en

🍺

Beer Capital

Famous for its brewing heritage, including the renowned Stella Artois.

πŸš„

Well Connected

Easy access to Brussels, Antwerp, and other European cities.