Siemens EDA (Siemens Digital Industries Software)

Transform software verification: Find and fix critical issues months before silicon 🛠️ When developing complex SoCs, software teams face a tough tradeoff: Functional models that are too slow for real-time verification FPGA prototypes that take months to deploy and lack deep debug visibility By the time silicon arrives, it’s often too late to catch issues without costly delays. ⏱️ That’s where Siemens Veloce™ proFPGA CS changes the game: ◄ Production-level performance for real-time verification ◄ Advanced software-centric debug (including probeless read + full visibility readback) ◄ Rapid deployment in days, not months ◄ Hardware-accurate behavior beyond functional models ◄ Real-world impact: One leading automotive company identified timing issues in ADAS software three months before silicon—avoiding what could have been a 6-month product launch delay. Read the full article on how early software prototyping is reshaping the path to first silicon and beyond. #SoC #FPGA #SoftwarePrototyping #Semiconductors #SiemensEDA

This summer at #62DAC, we unveiled our new EDA AI system: generative and agentic AI tools across the EDA portfolio designed to boost productivity and accelerate time to market. Enhancements include workflow integrations with NVIDIA technologies and a new, secure AI system for semiconductor and PCB design environments that helps improve system-on-a-chip (SoC) and chip design flows, PCB systems design and verification. #SemiconductorIndustry #Electronics

Accessing our tools for academic use has never been easier. 🏫 Purdue University College of Engineering’s Chipshub has been named the official NSF Chip Design Hub, backed by $7M over five years. 📣 This is a big step in broadening semiconductor education — connecting classroom learning with real chip fabrication and lab testing so students gain hands-on experience across the full design pipeline. Already serving 200+ users at 22 universities, 10 companies, and 2 government labs, Chipshub is now working to expand to 100+ higher education institutions nationwide. With our tools integrated, students and researchers can train on industry-standard software, making the path from education to the semiconductor workforce stronger than ever. Check out the link in the comments for next steps! ⬇️

The printed circuit board (PCB) skills gap continues to widen, creating significant challenges across industries. 🏫 Professor Amar Basu of Wayne State University, through his work on the university's industrial advisory board, regularly hears from automotive manufacturers about this critical issue. "One interesting comment from these companies is, a few years ago they used to hire mostly mechanical engineers. Now they're hiring more like 90% electrical engineers," notes Basu, adding that "nowadays, vehicles have more than 100 printed circuit boards." To address this shift, we've collaborated with Wayne State University and have launched a new program designed to equip students with the essential PCB design skills that industry requires. Check out the link in the comments for the details. 🔗

We see three distinct waves of EDA AI agents coming, each unlocking greater autonomy and transformative capabilities. 🌊 The first wave introduces task-specific AI agents designed to manage repetitive or technically demanding tasks within the EDA workflow. Engineers coordinate agents across the flow and provide frequent guidance. 🌊 Wave two introduces agentic AI, which are solutions that are no longer just reactive but proactive, capable of sophisticated reasoning, planning, and self-improvement. An engineer or a purpose-built supervisory agentic AI orchestrates, adapting the workflow, resolving conflicts, and optimizing outputs. 🌊 The third wave scales the intelligence up, multiplying the relationship between the engineer and the AI solution from a 1:1 to a 1:10 or 1:100 ratio. Engineers become strategic supervisors, reviewing outcomes, selecting optimal solutions, or suggesting fundamentally different design approaches. Learn more in the whitepaper below by AI expert Niranjan Sitapure, PhD! #Electronics #SemiconductorIndustry

We're thrilled to unveil our new EDA AI system: a purpose-built generative and agentic AI system that seamlessly integrates assistants, reasoners, and agents across the entire semiconductor and PCB design workflow. It has: 🔄 Seamless integration across the EDA toolchain — from high-level synthesis to physical verification 🧩 Highly customizable architecture, enabling customers to integrate with existing AI infrastructure, their own data, and best-in-class AI models 🔒 Security at its core, featuring full custom access controls and on-premise deployment options to protect sensitive design data Watch the full video with Niranjan Sitapure, PhD to discover how this foundational technology is set to transform EDA! #Semiconductor #PCBDesign #AI

It's very clear— a successful future needs innovators. 💡Specifically, a future in which software-defined everything requires advanced creativity and innovations in semiconductor development. This is why we're so excited to share that we've launched the Cre8Ventures Open Higher Education Program, an ambitious new initiative developed in collaboration with Arm and the University of Southampton’s School of Electronics and Computer Science (ECS @ UoS), to foster entrepreneurial curiosity and accelerate student-led semiconductor innovation across Europe’s leading technical universities. 🧑🏼🎓 The goal? Empower Europe’s next generation of semiconductor innovators with an open higher education program and serve as a launchpad for entrepreneurial talent. By integrating the Cre8Ventures collaborative venturing initiative and our advanced multi-physics Digital Twin Marketplace, industry-leading Arm technology and developer resources and ECS’s world-class lab-to-fab capabilities, the initiative creates a bridge between academia, industry and policymakers. Students will gain access to industrial-grade tools, partner design platforms, and educational materials to help bring their ideas from the classroom to the commercial world. ✅ “This initiative delivers clear value across the ecosystem. For students, they are able to accelerate learning and startup creation with industrial-grade tools. For universities, it brings broader curricula, higher student engagement, and direct commercialization routes,” said Geoff Lee, our VP, Siemens EDA EMEA. “We believe that our work with Arm and the University of Southampton can help to bring a scalable, sovereign solution to Europe’s semiconductor skills gap and help bring early access to validated innovations and emerging talent to the semiconductor industry.” The Siemens Cre8Ventures Open Higher Education Program provides students with: • Access to Siemens’ Digital Twin Marketplace and world-class EDA tools • Arm Academic Access and Arm Flexible Access for Startups programs and developer training • Hands-on experience through partner workshops, design kits and entrepreneurial bootcamps • Commercial licensing pathways and early validation through prototype-ready spinouts • Entrepreneurial support to help turn ideas into investor-ready startups Through structured innovation stages - from Proof-of-Technology through Proof-of-Concept to Proof-of-Value - students can move from academic projects to funded startups with the program supporting market validation, prototyping and engagement with Siemens' and Arm’s global corporate customer networks.   Siemens Cre8Ventures, Arm and ECS are now actively engaging with other leading technical universities and Chips Act Competence Centers across Europe to expand the program. This effort supports the EU Chips Act’s sovereignty goals by building a scalable pipeline of commercially minded semiconductor talent. Read more at the link in the comments 🔗.

Congratulations to Ivan Kissiov, principal engineer at Siemens EDA, on receiving the Si2 Pinnacle Award! 🏆 Ivan’s recognition reflects not only his decades of expertise in EDA and software design, but also his visionary leadership as chair of the Si2 AI/ML Schema OpenStandards Work Group. His work on developing an ontology-based schema system—integrated with large language models and advanced software principles—is helping shape a more open, intelligent foundation for the future of electronic design automation. At Siemens, this kind of innovation drives our Calibre AI initiatives forward. We’re proud to be leading the effort to bring AI-driven design rule checking into the mainstream—transforming how the industry accelerates verification, collaboration, and productivity. Well done, Ivan—and here’s to what’s next! 👏👏 #CalibreAI #SemiconductorDesign #EDA #ICDesign

Electronic component manufacturers—are you ready for a new model for enhanced digital customer engagement and operational efficiency in electronics design? Say hello to PartQuest Design Enablement! Today we launch the PartQuest Design Enablement portfolio, a new, connected digital environment for electronic component manufacturers looking to scale smarter, more personalized and persistent engagement with their customers and prospects. Microchip Technology Inc. collaborated with us as an early adopter, leveraging the technology to streamline workflows and empower customers across the design journey. How can it help your business? 📈📊 PartQuest Design Enablement transforms traditional, fragmented support and content experiences by delivering a persistent, data-driven environment that connects product discovery, interactive content, BOM intelligence, collaboration and digital support into one seamless journey. It empowers component manufacturers to turn every customer touchpoint into an opportunity for insight, enablement, and deeper engagement. “PartQuest Design Enablement represents a strategic leap forward in how electronic component manufacturers build digital relationships with their customers,” said AJ Incorvaia, our senior vice president. “By unifying design content, supply intelligence, collaboration and real-time analytics, PartQuest Design Enablement gives manufacturers like Microchip a powerful way to drive both operational efficiency and customer satisfaction at scale.” We unveiled the new software flow during Microchip MASTERs 2025, where Microchip Technology’s Chief Operating Officer, Rich Simoncic, highlighted PartQuest Design Enablement’s relevance to the future of customer experience in the electronics industry. “PartQuest Design Enablement represents a meaningful evolution in how we connect with and support the engineering community. Collaborating with Siemens on this initiative allows us to deliver a complete, intuitive customer experience that reflects how modern engineering teams operate. The collaboration demonstrates Microchip’s core strategy of delivering total system solutions by working closely with industry leaders to develop and improve embedded ecosystems.” At the event, we're showcasing how PartQuest Design Enablement streamlines the journey from idea to implementation, using Siemens tools, intelligent block-based design from CELUS, and Microchip’s design assets, with working boards of a classic electronic memory game using Microchip components available as take-home giveaways for attendees. For more information on PartQuest Design Enablement and its availability, check out the comments below. #DesignEnablement #EDA #ElectronicComponents

As chiplet-based architecture has become the foundation for next-generation AI, HPC, and data-centric systems, the need for a robust, open, and scalable interconnect standard has never been greater. With the release of the UCIe™ 3.0 specification, the industry takes a major step forward—doubling bandwidth, enhancing power efficiency, alike continuous transmission protocols and emergency shutdown support. 💪 Design teams are already exploring how to integrate these new capabilities into their chiplet-based systems. But with innovation comes comnd enabling new use cases plexity—especially in verification. That’s where Siemens EDA continues to play a pivotal role. ⭐ We’re proud to be a trusted partner in the evolution of UCIe! 🤝 “Building on the long-standing relationship our Avery Verification IP team has with the UCIe standards body, and our collaboration with the leading innovators in UCIe semiconductor design, Siemens EDA is once again a key contributor for the newest version of UCIe technology,” said Gordon Allan, Director, Questa One Avery Verification IP at Siemens EDA. “We welcome this latest release of the UCIe solution from the UCIe Consortium, and we are seeing the impact this has already with our collaborations with leading edge users to build new, exciting applications across all markets for chiplet makers, integrators and foundry providers.” See the first comment for more information on UCIe 3.0 🔗