SMV

(redirected from Stacked MicroVia)
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SMVSigmatel Motion Video
SMVSupport Mp4 Video
SMVSlow Moving Vehicle
SMVStanley Clarke, Marcus Miller, Victor Wooten (band)
SMVScience Museum of Virginia
SMVStolen Motor Vehicle (crime)
SMVSanta Maria Valley (railroad)
SMVSchülermitverwaltung (German local pupils' organisations)
SMVSoybean Mosaic Virus
SMVSelectable Mode Vocoder
SMVSuperior Mesenteric Vein
SMVSake Meter Value
SMVSpace Maneuver Vehicle
SMVStop Motion Video
SMVSymbolic Model Verifier
SMVSwiss Mountain Village (resort; Blowing Rock, NC)
SMVSony Music Video
SMVSuperior Medullary Velum (central nervous system)
SMVSanta Maria Valley Railroad
SMVStar of Military Valour (Canada)
SMVsubmentovertex (radiograph)
SMVStrategic Marketing Ventures, Inc. (Warrenton, VA)
SMVSociété de Médecine des Voyages (French: Society of Travel Medicine)
SMVSurveying and Mapping Victoria (Australia)
SMVSexual Market Value
SMVSweet Mini Van
SMVStandard Minute Value (UK)
SMVStacked MicroVia (trademark of DDi Corp.)
SMVSaint-Marcel Vernon (French handball team)
SMVSkill Matching Visa
SMVSociété Mycologique Vaudoise (French: Vaudoise Mycological Society; Switzerland)
SMVSélections Mondiales des Vins (French: World Wine Selections; Canada)
SMVSandia Monitoring Visit
SMVSimple Multi-Visit
SMVSmooth-Membrane Vesicle (virology)
SMVShadow Mountain Village Mobile Home Park (Scottsdale, Arizona)
SMVSilver Medal of Valor (US Civil Air Patrol)
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References in periodicals archive ?
To go deeper or incorporate multiple layers within the PCB requires the use of stacked microvia technology.
Stacked microvia technology can go down to layer five by stacking microvias and using a solid copper plate to eliminate via-in-pad issues at assembly.
Additionally, the use of an 0.8-mm pitch BGA is the time to consider microvia technology, and a high I/O count 0.5-mm pitch device pushes the consideration for stacked microvia technology.
BGA/PCB interconnect design guidelines: a successful BGA design is the right combination of pad diameter, drill diameter, anti-pad and aspect ratio that maximizes the routing density
Stacked MicroVia (SMV) technology reduces layer count and improves performance of printed circuit boards (PCB) currently using standard and fine-pitch (compact) devices.
Stacked MicroVia technology
Staggered microvias are used in Figure 5 and stacked microvias used in Figures 6, 7 and 8.
Most PCB designers use blind, stacked microvias and buried vias as the routing solutions for the 0.5-mm pitch BGA.
Metric pitch BGA and micro BGA routing solutions: for designers, working with metric units increases performance and overall quality
Stacked microvias and 2-3 HDI layers on each side will be needed.
The laser drilling horse race: UV lasers, C[O.sub.2] lasers and hybrids all offer advantages and disadvantages. Will one technology make the others obsolete?
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